Designers are finding it necessary to use build-up technology (High Density Interconnect) to put their designs in high pin-count packages such as BGA. Even if using interfaces such as DDRx and PCIe, they may be forced to move to HDI to get BGA fanouts. This requires a PCB design system that can simultaneously handle the design requirements coming from these protocols and also from the build-up technology using HDI.
Look here: http://www.demosondemand.com/dod/proddemos/vendors/pd_cadence.aspx#CAD071 to see Cadence's value-added approach to HDI.
The way Cadence describes it:
"The Cadence Allegro Constraint-Driven HDI design flow offers a "holistic" solution, integrating the power of our robust PCB flow for high-speed designs with HDI rules for electrical constraints. This flow delivers the automation necessary to create designs that are correct-by-construction, meeting the challenges of even the most difficult HDI designs."Take a look, send me a comment, and forward this demo to your board-designer colleagues!
(To send a question directly to Cadence, click the button at the bottom of the player!)
Sheila Carey
Demos on Demand™
Coming Up:
- Front-to-Back Constraint-Driven PCB Design Flow
- Startup IP vendor offers optimal performance, low power, smaller area and higher yield
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